苏州通富超威半导体 招聘岗位-

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苏州通富超威半导体 招聘岗位
2018-02-06

 1   R&D/Sr. Process Development Engineer/资深工艺开发工程师

 

Job Responsibilities: 

1. Collaborate with customers to understand their package roadmap and integrate it into company’s roadmap
2. Be the main person in the company to keep abreast of the latest industry technology and provide solutions/recommendations to keep company competitive.
3. Develop and evaluate latest materials/equipment technology for new package/product.
4. Carry out initial testing and provide upfront technical risk assessment for new materials/equipment.
5. Communicate with technical program manager/customer to understand customer expectations and prepare samples to meet customer requirements
6. See through the development of new materials/equipment from inception to successful implementation into NPI stage
7. Provide materials/equipment roadmap in tandem with the development of new package/product
8. Assist operations cost down projects in evaluating new material, equipment, technology and process

Job Qualifications: 

1. Bachelor degree or above, related field. 
2. Excellent oral and written skills in English and Mandarin. 
3. 5~8years’ work experience including 3~5 years’ process expertise experience in a high paced environment.

4. Knowing of Flip Chip BGA processes.
5. Good communication skill in both Chinese and English, good presentation skills.
6. Assy. process background is preferred for assembly process engineering.
7. Knowledge of wafer bumping process & substrate technology.

 

 

 2   R&D/Sr. Substrate Engineer/资深基板开发工程师

Job Responsibilities:

1. Be the main person in the company to keep abreast of the latest industry technology and provide solutions/recommendations to keep company competitive.
2. Provide regular Flip Chip substrate roadmap by material property & technology based on customer/market demands to keep company competitive.
3. Develop and evaluate latest substrate technology for new package/product.
4. Provide substrate roadmap in tandem with the development of new package/product
5. Qualified candidate could ensure substrate DFM(Design for Manufacturing) for NPI & sustain HVM quality through interaction with supplier vendors.

Job Qualifications:

1. Bachelor degree or above, related field. 
2. Excellent oral and written  skills in English and Mandarin. 
3. 5~8years’ work experience including 3~5 years’ process expertise experience in a high paced environment.

4. Knowing of Flip Chip BGA assembly processes.
5. Good communication skill in both Chinese and English, good presentation skills.
6. Assy. process background is preferred for assembly process engineering.
7. Knowledge of substrate technology & manufacturing process.

 

 

 3   R&D/Sr. Packaging Engineer/资深封装开发工程师

Job Responsibilities:

1. Responsible for Assembly & Packaging NPI at AMD Suzhou.
2. Coordinate and responsible for new product Packaging/Assembly development and qualification at TF-AMD Suzhou.
3. Drive and work with Assembly process team for yield improvement during NPI stage.
4. Participate in problem solving of Assembly & packaging related Failure Analysis.
5. Familiar with the quality and reliability test conditions and specifications.
6. Interface with materials suppliers for engineering and quality related issues.
7. Team lead responsible to guide junior engineers.
8. Others tasks assigned by supervisor.

Job Qualifications:

1. Bachelor degree or above, related field. 
2. Excellent oral and written  skills in English and Mandarin. 
3. 5-8 years’ industrial experience with 3-5 years’ in flip chip packaging & assembly development.

4. Project Management
5. Good understanding of Semiconductor processes.
6. Experience and knowledge in C4 Assembly and packaging technology
7. Knowledge on Six Sigma and Lean



简历投递地址:


szhr@tf-amd.com





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